Microelectronics Packaging Handbook, Part III: Subsystem Packaging (Pt. 1) by R.R. Tummala


Microelectronics Packaging Handbook, Part III: Subsystem Packaging (Pt. 1) by R.R. Tummala

Download Microelectronics Packaging Handbook, Part III: Subsystem Packaging (Pt. 1) ebook by R.R. Tummala

Type: pdf, ePub, zip, txt
Publisher: Springer
Released: 1997
Page Count: 628
Language: English
ISBN-10: 0412084511
ISBN-13: 978-0412084515

Download link: Microelectronics Packaging Handbook, Part III: Subsystem Packaging (Pt. 1)

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Review`A most comprehensive book set, both well presented and well illustrated. IEEE Electrical Insulation Magazine, September/October 1997... read more ...











 
 
 
 
 
 



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